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陈思杰, 唐恒娟, 赵丕锋
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陈思杰, 唐恒娟, 赵丕锋  
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DOI:10.3969/j.issn.1004-5341.2017.02.007
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A two-step transient liquid phase diffusion bonding process of T91 steels
Chen Sijie, Tang Hengjuan and Zhao Pifeng
Abstract:
In this study, a two-step heating process is introduced for transient liquid phase(TLP) diffusion bonding for sound joints with T91 heat resistant steels. At first, ashort-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T91 heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend’s strengths are enhanced due to the higher metal-to-metal junction producing anon-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 ℃ for 0.5 min and 1 230 ℃ for 4 min.
Key words:  T91, transient liquid phase diffusion bonding, two-step heating process, scanning electron microscopy