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石 林, 孙凤莲, 刘 洋, 张洪武
作者单位
石 林, 孙凤莲, 刘 洋, 张洪武  
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DOI:10.3969/j.issn.1004-5341.2017.02.002
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基金项目:
Properties analysis of a new type of solder paste SACBN07
Shi Lin, Sun Fenglian, Liu Yang and Zhang Hongwu
Abstract:
In this work,the wettability,aging and shear properties of a new type of lead-free solder paste Sn-07Ag-05Cu + BiNi(SACBN07) was investigated by conducting a series of comparison experiments with SAC305 and SAC0307 solder paste. The results show that wettability of SACBN07 is almost equal to SAC305, and better than that of SAC0307 solder paste. The thickness of intermetallic compound(IMC) layer in SACBN07/Cu is lower than that of other two types of solder joint after aging. And Cu3Sn layer of SACBN07/Cu is thinner than that of SAC305 and SAC0307. In addition, the SACBN07 solder joints perform the best shear strength among these three types of solder pastes.
Key words:  solder paste, wettability, thermal aging, intermetallic compound, shear strength